Primary product support for FaradFlex ultra-thin laminates for embedded capacitance, RF, MEM’s, Modules, Chip Packages. Also supports Mitsui advanced technology copper products.
Over 34 years professional experience in the printed circuit design and manufacturing, advanced electronic materials, and chip packaging industries. Lead applications engineering, marketing, and sales worldwide for Oak-Mitsui Technologies. Previously directed and managed similar organizations at Xerox, Toppan, Multi-Fineline Electronix, Rogers Corporation, and Panasonic Electronic Materials. Initiated the start-up of 2 major PCB factories in China.
Bob has a Bachelor of Science Degree studying Chemical & Materials Engineering and Business Management at California Polytechnic University, Pomona, California and Grand Canyon University, Phoenix, Arizona.