FaradFlex™ MCM, MCTM, and MCL series are easy to process, and have been used commercially for the longest. These materials are commonly used in planar applications, most popular being telecom and high speed applications. The laminate is constructed with copper and epoxy or other type resin bonded to a high performance polymer film. Common copper thicknesses offered are 5 microns, 18 microns (0.5 oz), 35 microns (1.0 oz), and 70 micron (2.0 oz).