• Highest Dk for highest capacitance
• Thinner for additional capacitance
• Low loss versions for RF filtering
• Lowest noise, lowest impedence/low inductance
• LD and ST most stable Df and Dk over frequency, temperature, and humidity
• Reduced resonance over frequency (thinner is better)
• Removes discrete capacitors, traces, vias, and pads from surface
• Improves/increases design space
• Major reduction in PCBA failures including field failures
• Cost reduction due to reduction of components and assembly
• PCB size and weight reduction
• Reduction of EMI and Noise