IPC APEX EXPO 2020

February 4-6
Exhibits Booth#4145
2/4 Tuesday 10 AM to 6 PM
2/5 Wednesday 9 AM to 6 PM
2/6 Thursday 9 AM to 2 PM
San Diego Convention Center
111 W Harbor Dr.
San Diego, CA 92101

We will be presenting at APEX EXPO

Date: February 5, Wednesday
Time: 3:30 PM to 5:00 PM
Location: 31AB
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
Robert Carter
(Vice President of Technology and Business Development, Oak-Mitsui Technologies)

Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to accommodate higher speeds and good signal integrity. With 5G technology on the horizon there is heightened concern for signal loss affecting product performance. It is more important than ever to analyze loss factor at the earliest design stage. This analysis is done for the PCB materials by manufacturing electrical test coupons prior to building the PCB and evaluating the electrical performance.  These coupons are designed and built with (TEG, test element group) structures which are ideal for measuring transmission loss. However, often these test PCBs use different lots of raw laminate materials which yield different results. Why? This study examines possible factors for these inconsistencies such as etched signal trace shape, surface treatment, and grain size.

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