DesignCon 2020 Recap

Paper Well Received!

Robert Carter and Igal Fridman presented “Power Delivery Improvement & Noise Reduction Using Ultra-Thin (8um) PCB Layers: Simulation, Board Measurements & Practice” co-written by Alex Manukovsky, Shimon Mordooch, and Amiram Jibly on January 30th, Thursday. The room was filled with 70 plus engineers! The presentation included practical implementation of embedded capacitance technology, simulation results, corresponding measurements and manufacturing analysis.

Our team!

We had a member from Mitsui’s Taiwan factory join us at DesignCon, Ayumu Tateoka (Very right in the back row). Also to the very left is our newest Oak-Mitsui Technology member, Kensuke Nakamura (CMO, Senior Vice President). He is an expert on MicroThin™, ultra thin copper. 

Yuji Kageyama who leads FaradFlex® product development based at the Mitsui Ageo factory (back row, middle) was also there so support us. Always great to have our worldwide members join us at trade shows! Thank you team for making this another great year at DesignCon.

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