Meeting the demands of

High Performance PCBs

FaradFlex™, Oak-Mitsui Technologies’ family of embedded capacitance materials is the solution for the next generation of high performance PCBs, modules, packages, and for designs that require high data rates, optimum signal and power integrity, minimized EMI, reduced surface mount passives, and higher reliability. We stock FaradFlex™ materials at our HQ in Kentucky, contact us today to order.

Embedded Capacitance

FaradFlex™ is the world’s leading ultra thin laminate for embedded capacitance technology in PCBs, modules, and packaging substrates.
With the increase in routing density, more active and passive devices, concern over board resonances and EMI, FaradFlex™ is becoming the solution of choice for designers.

FAQs

What does FaradFlex™ do? How is it used? Who should utilize FaradFlex™? How many capacitors can be removed? Are there tips to processing the ultra thin material? What other laminates are compatible with FaradFlex™?

Visit the FAQ page to find answers to these questions.

Upcoming Events


IEEE International Microwave Symposium 2021

June 6 – 11 2021, Atlanta, GA

DesignCon 2021

August 16-18 2021, San Jose, CA

Southeastern Michigan IEEE EMC Society EMC Fest 2021

September 30 2021, Livonia, Michigan

Applications

Automotive

Telecom

MEMS

Military

Components

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