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Meeting the demands of
High Performance PCBs
FaradFlex™, Oak-Mitsui Technologies’ family of embedded capacitance materials is the solution for the next generation of high performance PCBs, modules, packages, and for designs that require high data rates, optimum signal and power integrity, minimized EMI, reduced surface mount passives, and higher reliability. We stock FaradFlex™ materials at our HQ in Kentucky, contact us today to order.
Embedded Capacitance
FaradFlex™ is the world’s leading ultra thin laminate for embedded capacitance technology in PCBs, modules, and packaging substrates.
With the increase in routing density, more active and passive devices, concern over board resonances and EMI, FaradFlex™ is becoming the solution of choice for designers.
With the increase in routing density, more active and passive devices, concern over board resonances and EMI, FaradFlex™ is becoming the solution of choice for designers.
FAQs
What does FaradFlex™ do?
How is it used?
Who should utilize FaradFlex™?
How many capacitors can be removed? Are there tips to processing the ultra thin material? What other laminates are compatible with FaradFlex™?
Visit the FAQ page to find answers to these questions.
Visit the FAQ page to find answers to these questions.
Upcoming Events
IMS 2023
June 11-16, 2023
San Diego, CA
PCB West 2023
September 19-22, 2023
Santa Clara, CA
PCB Carolina 2023
November 8, 2023
Raleigh, NC
