Oak-Mitsui Technologies is the global leader in developing, manufacturing, and providing ultra-thin advanced laminates, resin coated capacitor foils, and materials for printed circuits and other high technology applications. Our FaradFlex® laminates and resin coated capacitor foils provide the highest capacitance densities and most solution choices for embedded capacitance and ultra-thin material applications. In addition, FaradFlex® provides a very low impedance/ inductance power distribution path increasing the device efficiency and functionality at both lower and higher frequencies.
Oak Mitsui Technologies offers a versatile line of FaradFlex® products in various dielectric thicknesses. Our four main categories include:
|
|
BC xx M
These materials are unfilled dielectrics.
The thicknesses available include 24, 16, 12 and 8um.
|
 |
BC xx TM
These materials are partially filled dielectrics which contain a high Dk ceramic powder.
The thicknesses available include 12 and 8um.
|
 |
BC xx T
This material is a filled dielectric which contains a high Dk ceramic powder.
The thicknesses available include 25 and 16um.
|
 |
MC xx TR
This material is a single sided coated copper which contains a high Dk ceramic powder.
|