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BC24-BC8:
These products are typically used to lower the impedance (due to low inductance) of the PCB portion of the power distribution network. This allows the removal of most, if not all, decoupling capacitors of 0.1 μF or lower value. The resulting PDN also typically has much lower noise resulting in lower EMI. Decreased PCB thickness and weight are also benefits of implementation.
Examples: Servers, Routers, Test Equipment
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BC12TM, BC8TM:
Used for the most demanding decoupling applications, the combination of being extremely thin and having a higher Dk, provides the lowest level of PDN impedance and resulting lowest noise and EMI levels.
Examples: Supercomputers, servers, routers, military avionics and communications
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BC16T, MC25ST, BC12TM, BC8TM:
These products are typically used for discrete buried capacitance. FaradFlex frees up design space by eliminating the need to place discrete capacitors on the surface of the PCB, Module, or chip package. Space is a premium on many of these devices and there are few or no locations to place a capacitor with its vias, pad, and traces. By using Faradflex the device is etched into the copper and located in the substrate. It also provides a very short impedance path for the charge to the device from directly beneath it.
Examples: Memory module substrates, Folded Stacked Die packages, CA TV Filters, Power modules, Chip package substrates, RF Filter & Receiver Modules, RF Transmitter modules for WIFI & WIMAX
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